MCP6052-E/MNY
vs
TLV9002IDDFR
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
DFN
|
|
Package Description |
HVSON, SOLCC8,.11,20
|
SOT-23, 8 PIN
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
Average Bias Current-Max (IIB) |
0.0001 µA
|
|
Bias Current-Max (IIB) @25C |
0.0001 µA
|
|
Common-mode Reject Ratio-Nom |
91 dB
|
90 dB
|
Frequency Compensation |
YES
|
YES
|
Input Offset Voltage-Max |
150 µV
|
1500 µV
|
JESD-30 Code |
R-PDSO-N8
|
R-PDSO-G8
|
JESD-609 Code |
e4
|
e4
|
Length |
3 mm
|
2.9 mm
|
Low-Bias |
YES
|
YES
|
Low-Offset |
YES
|
NO
|
Micropower |
YES
|
YES
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
TSSOP
|
Package Equivalence Code |
SOLCC8,.11,20
|
TSSOP8,.11
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.8 mm
|
1.1 mm
|
Slew Rate-Nom |
0.15 V/us
|
2 V/us
|
Supply Current-Max |
0.09 mA
|
0.15 mA
|
Supply Voltage Limit-Max |
7 V
|
6 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Unity Gain BW-Nom |
385
|
1000
|
Voltage Gain-Min |
56200
|
158489
|
Width |
2 mm
|
1.6 mm
|
Base Number Matches |
1
|
1
|
Date Of Intro |
|
2019-05-31
|
Samacsys Manufacturer |
|
Texas Instruments
|
Common-mode Reject Ratio-Min |
|
63 dB
|
Packing Method |
|
TR
|
Power |
|
NO
|
Programmable Power |
|
NO
|
Wideband |
|
NO
|
|
|
|
Compare MCP6052-E/MNY with alternatives
Compare TLV9002IDDFR with alternatives