MCP6072T-E/SN
vs
TLV2376IDGKR
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
|
| Factory Lead Time |
67 Weeks, 1 Day
|
|
| Samacsys Manufacturer |
Microchip
|
Texas Instruments
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Average Bias Current-Max (IIB) |
0.005 µA
|
|
| Bias Current-Max (IIB) @25C |
0.0001 µA
|
|
| Common-mode Reject Ratio-Min |
74 dB
|
72 dB
|
| Common-mode Reject Ratio-Nom |
91 dB
|
88 dB
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
150 µV
|
100 µV
|
| JESD-30 Code |
R-PDSO-G8
|
S-PDSO-G8
|
| JESD-609 Code |
e3
|
e4
|
| Length |
4.9 mm
|
3 mm
|
| Low-Bias |
YES
|
|
| Low-Offset |
YES
|
|
| Micropower |
YES
|
|
| Moisture Sensitivity Level |
1
|
2
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Equivalence Code |
SOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TAPE AND REEL
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power |
NO
|
|
| Programmable Power |
NO
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
1.1 mm
|
| Slew Rate-Nom |
0.5 V/us
|
2 V/us
|
| Supply Current-Max |
0.34 mA
|
2.4 mA
|
| Supply Voltage Limit-Max |
7 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn)
|
NICKEL PALLADIUM GOLD SILVER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Unity Gain BW-Nom |
1200
|
5500
|
| Voltage Gain-Min |
56200
|
|
| Wideband |
NO
|
|
| Width |
3.9 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
TSSOP,
|
| Date Of Intro |
|
2016-11-02
|
|
|
|
Compare MCP6072T-E/SN with alternatives
Compare TLV2376IDGKR with alternatives