MCP607T-I/SN
vs
MCP607-I/ST
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
TELCOM SEMICONDUCTOR INC
|
TELCOM SEMICONDUCTOR INC
|
| Package Description |
PLASTIC, SOIC-8
|
SOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Common-mode Reject Ratio-Nom |
91 dB
|
91 dB
|
| Input Offset Voltage-Max |
250 µV
|
250 µV
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Slew Rate-Nom |
0.08 V/us
|
0.08 V/us
|
| Supply Voltage Limit-Max |
7 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
155
|
155
|
| Base Number Matches |
2
|
2
|
|
|
|