MCP607T-I/ST vs MCP607T-I/SL feature comparison

MCP607T-I/ST Microchip Technology Inc

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MCP607T-I/SL Telcom Semiconductor Inc

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC TELCOM SEMICONDUCTOR INC
Part Package Code SOIC
Package Description TSSOP, TSSOP8,.25 ,
Pin Count 8
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer Microchip
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.00008 µA
Common-mode Reject Ratio-Min 75 dB
Common-mode Reject Ratio-Nom 91 dB 91 dB
Frequency Compensation YES
Input Offset Voltage-Max 250 µV 250 µV
JESD-30 Code R-PDSO-G8 R-PDSO-G14
JESD-609 Code e3
Length 4.4 mm
Low-Bias YES
Low-Offset YES
Micropower YES
Moisture Sensitivity Level 1
Number of Functions 2 2
Number of Terminals 8 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Packing Method TAPE AND REEL
Peak Reflow Temperature (Cel) 260
Power NO
Programmable Power NO
Qualification Status Not Qualified Not Qualified
Screening Level TS 16949
Seated Height-Max 1.2 mm
Slew Rate-Nom 0.08 V/us 0.08 V/us
Supply Current-Max 0.05 mA
Supply Voltage Limit-Max 7 V 7 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Unity Gain BW-Nom 155 155
Voltage Gain-Min 100000
Wideband NO
Width 3 mm
Base Number Matches 2 1

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Compare MCP607T-I/SL with alternatives