MCP6232T-E/MN
vs
MCP6232-E/P
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
0.300 INCH, LEAD FREE, PLASTIC, DIP-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Base Number Matches |
3
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
8
|
| Factory Lead Time |
|
8 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
|
0.0011 µA
|
| Common-mode Reject Ratio-Min |
|
61 dB
|
| Common-mode Reject Ratio-Nom |
|
75 dB
|
| Frequency Compensation |
|
YES
|
| Input Offset Voltage-Max |
|
7000 µV
|
| JESD-30 Code |
|
R-PDIP-T8
|
| JESD-609 Code |
|
e3
|
| Length |
|
9.271 mm
|
| Low-Bias |
|
YES
|
| Low-Offset |
|
NO
|
| Micropower |
|
YES
|
| Number of Functions |
|
2
|
| Number of Terminals |
|
8
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP8,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Packing Method |
|
TUBE
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
5.334 mm
|
| Slew Rate-Nom |
|
0.15 V/us
|
| Supply Current-Max |
|
0.06 mA
|
| Supply Voltage Limit-Max |
|
7 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
| Unity Gain BW-Nom |
|
300
|
| Voltage Gain-Min |
|
31620
|
| Wideband |
|
NO
|
| Width |
|
7.62 mm
|
|
|
|
Compare MCP6232T-E/MN with alternatives
Compare MCP6232-E/P with alternatives