MCP6232T-E/MNYVAO
vs
MCP6232T-E/MN
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HSON,
|
,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Samacsys Manufacturer |
Microchip
|
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
|
Common-mode Reject Ratio-Min |
61 dB
|
|
Common-mode Reject Ratio-Nom |
75 dB
|
|
Frequency Compensation |
YES
|
|
Input Offset Voltage-Max |
7000 µV
|
|
JESD-30 Code |
R-PDSO-N8
|
|
JESD-609 Code |
e4
|
|
Length |
3 mm
|
|
Low-Bias |
YES
|
|
Low-Offset |
NO
|
|
Micropower |
YES
|
|
Number of Functions |
2
|
|
Number of Terminals |
8
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
HVSON
|
|
Package Equivalence Code |
SOLCC8,.08,20
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
Packing Method |
TR
|
|
Power |
NO
|
|
Programmable Power |
NO
|
|
Screening Level |
AEC-Q100; TS 16949
|
|
Seated Height-Max |
0.8 mm
|
|
Slew Rate-Nom |
0.15 V/us
|
|
Supply Current-Max |
0.06 mA
|
|
Supply Voltage Limit-Max |
7 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
NO LEAD
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
DUAL
|
|
Unity Gain BW-Nom |
300
|
|
Voltage Gain-Min |
31622
|
|
Wideband |
NO
|
|
Width |
2 mm
|
|
Base Number Matches |
1
|
3
|
|
|
|
Compare MCP6232T-E/MNYVAO with alternatives
Compare MCP6232T-E/MN with alternatives