MCP6232T-E/MNYVAO
vs
MCP6232T-E/P
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HSON,
|
,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
Microchip
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Common-mode Reject Ratio-Min |
61 dB
|
|
| Common-mode Reject Ratio-Nom |
75 dB
|
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
7000 µV
|
|
| JESD-30 Code |
R-PDSO-N8
|
|
| JESD-609 Code |
e4
|
|
| Length |
3 mm
|
|
| Low-Bias |
YES
|
|
| Low-Offset |
NO
|
|
| Micropower |
YES
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HVSON
|
|
| Package Equivalence Code |
SOLCC8,.08,20
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
| Packing Method |
TR
|
|
| Power |
NO
|
|
| Programmable Power |
NO
|
|
| Screening Level |
AEC-Q100; TS 16949
|
|
| Seated Height-Max |
0.8 mm
|
|
| Slew Rate-Nom |
0.15 V/us
|
|
| Supply Current-Max |
0.06 mA
|
|
| Supply Voltage Limit-Max |
7 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
DUAL
|
|
| Unity Gain BW-Nom |
300
|
|
| Voltage Gain-Min |
31622
|
|
| Wideband |
NO
|
|
| Width |
2 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MCP6232T-E/MNYVAO with alternatives
Compare MCP6232T-E/P with alternatives