MCP624-E/SL
vs
LMV324QPWG4
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
TSSOP
|
| Package Description |
SOP, SOP14,.25
|
TSSOP-14
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.33.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.005 µA
|
0.25 µA
|
| Common-mode Reject Ratio-Min |
68 dB
|
|
| Common-mode Reject Ratio-Nom |
84 dB
|
65 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
200 µV
|
7000 µV
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e3
|
e4
|
| Length |
8.65 mm
|
5 mm
|
| Low-Bias |
YES
|
NO
|
| Low-Offset |
YES
|
NO
|
| Micropower |
NO
|
YES
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Equivalence Code |
SOP14,.25
|
TSSOP14,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TUBE
|
TUBE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1.75 mm
|
1.2 mm
|
| Slew Rate-Nom |
10 V/us
|
1 V/us
|
| Supply Current-Max |
14.4 mA
|
1.16 mA
|
| Supply Voltage Limit-Max |
6.5 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Unity Gain BW-Nom |
20000
|
1000
|
| Voltage Gain-Min |
25110
|
10000
|
| Wideband |
NO
|
NO
|
| Width |
3.9 mm
|
4.4 mm
|
| Base Number Matches |
1
|
1
|
| Bias Current-Max (IIB) @25C |
|
0.25 µA
|
|
|
|
Compare MCP624-E/SL with alternatives
Compare LMV324QPWG4 with alternatives