MCP655-E/ML vs ISL55290IUZ feature comparison

MCP655-E/ML Microchip Technology Inc

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ISL55290IUZ Intersil Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC INTERSIL CORP
Part Package Code QFN MSOP
Package Description HVQCCN, ROHS COMPLIANT, MSOP-10
Pin Count 16 10
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.005 µA 40 µA
Common-mode Reject Ratio-Nom 81 dB 95 dB
Input Offset Voltage-Max 200 µV 500 µV
JESD-30 Code S-PQCC-N16 S-PDSO-G10
Length 4 mm 3 mm
Number of Functions 2 2
Number of Terminals 16 10
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN TSSOP
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.1 mm
Slew Rate-Nom 30 V/us 268 V/us
Supply Voltage Limit-Max 6.5 V 5.5 V
Supply Voltage-Nom (Vsup) 2.5 V 5 V
Surface Mount YES YES
Technology CMOS BICMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position QUAD DUAL
Unity Gain BW-Nom 50000 800000
Width 4 mm 3 mm
Base Number Matches 1 3
Rohs Code Yes
Factory Lead Time 4 Weeks
Architecture VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C 40 µA
Frequency Compensation YES
JESD-609 Code e3
Low-Bias NO
Low-Offset YES
Micropower NO
Moisture Sensitivity Level 2
Package Equivalence Code TSSOP10,.19,20
Peak Reflow Temperature (Cel) 260
Power NO
Programmable Power NO
Slew Rate-Min 163 V/us
Supply Current-Max 38 mA
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30
Voltage Gain-Min 17780
Wideband YES

Compare MCP655-E/ML with alternatives

Compare ISL55290IUZ with alternatives