MCP6G01-E/MS
vs
MCP6G01UT-E/SN
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
MSOP
|
SOIC
|
Package Description |
TSSOP, TSSOP8,.19
|
SOP,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Samacsys Manufacturer |
Microchip
|
|
Amplifier Type |
INSTRUMENTATION AMPLIFIER
|
INSTRUMENTATION AMPLIFIER
|
Average Bias Current-Max (IIB) |
0.005 µA
|
|
Bandwidth (3dB)-Nom |
0.9 MHz
|
0.9 MHz
|
Input Offset Voltage-Max |
4500 µV
|
4500 µV
|
JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
4.9 mm
|
Moisture Sensitivity Level |
1
|
1
|
Non-linearity-Max |
0.05%
|
0.05%
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SOP
|
Package Equivalence Code |
TSSOP8,.19
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Packing Method |
TUBE
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
TS 16949
|
|
Seated Height-Max |
1.18 mm
|
1.75 mm
|
Slew Rate-Nom |
4.5 V/us
|
|
Supply Current-Max |
0.17 mA
|
|
Supply Voltage Limit-Max |
7 V
|
7 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Voltage Gain-Max |
50
|
50
|
Voltage Gain-Min |
1
|
1
|
Voltage Gain-Nom |
10
|
10
|
Width |
3 mm
|
3.9116 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MCP6G01-E/MS with alternatives
Compare MCP6G01UT-E/SN with alternatives