MCP6S26-I/SL
vs
ADS1196CPAG
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
QFP
|
| Package Description |
SOP, SOP14,.25
|
GREEN, PLASTIC, TQFP-64
|
| Pin Count |
14
|
64
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
Texas Instruments
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
| JESD-30 Code |
R-PDSO-G14
|
S-PQFP-G64
|
| JESD-609 Code |
e3
|
e4
|
| Length |
8.69 mm
|
10 mm
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Channels |
6
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
64
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TFQFP
|
| Package Equivalence Code |
SOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1.75 mm
|
1.2 mm
|
| Supply Current-Max (Isup) |
1.35 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
4 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
3.9 mm
|
10 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Additional Feature |
|
ALSO OPERATES WITH 1.65V TO 3.6V DIGITAL SUPPLY
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MCP6S26-I/SL with alternatives
Compare ADS1196CPAG with alternatives