MCR01MRTJ333 vs RK73B1ETTD333J feature comparison

MCR01MRTJ333 ROHM Semiconductor

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RK73B1ETTD333J KOA Corporation

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Package Description CHIP SMT, 0402
Reach Compliance Code compliant unknown
Construction Chip Chip
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.35 mm 0.35 mm
Package Length 1 mm 1 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 0.5 mm 0.5 mm
Packing Method TR, PAPER, 7 INCH TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.063 W 0.063 W
Rated Temperature 70 °C 70 °C
Reference Standard TS 16949 MIL-R-55342F
Resistance 33000 Ω 33000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0402 0402
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 5% 5%
Working Voltage 50 V 50 V
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8533.21.00.30
YTEOL 7.9
Additional Feature REFERENCE STANDARD : MIL-R-55342F

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