MCR08BT1,115
vs
2N885
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
CENTRAL SEMICONDUCTOR CORP
|
| Part Package Code |
SC-73
|
|
| Package Description |
PLASTIC, SC-73, 4 PIN
|
|
| Pin Count |
4
|
|
| Manufacturer Package Code |
SOT223
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.30.00.80
|
8541.30.00.80
|
| Additional Feature |
SENSITIVE GATE
|
|
| Case Connection |
ANODE
|
|
| Circuit Commutated Turn-off Time-Nom |
100 µs
|
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Gate Trigger Current-Max |
0.2 mA
|
0.02 mA
|
| DC Gate Trigger Voltage-Max |
0.8 V
|
0.6 V
|
| Holding Current-Max |
5 mA
|
1 mA
|
| JESD-30 Code |
R-PDSO-G4
|
O-MBCY-W3
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Non-Repetitive Pk On-state Cur |
9 A
|
20 A
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
4
|
3
|
| On-state Current-Max |
500 A
|
350 A
|
| Operating Temperature-Max |
125 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-60 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
METAL
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
CYLINDRICAL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RMS On-state Current-Max |
0.8 A
|
0.8 A
|
| Repetitive Peak Off-state Voltage |
200 V
|
30 V
|
| Repetitive Peak Reverse Voltage |
200 V
|
30 V
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
WIRE
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Device Type |
SCR
|
SCR
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
No
|
| JEDEC-95 Code |
|
TO-18
|
| Leakage Current-Max |
|
0.02 mA
|
|
|
|
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