MIC3172YN
vs
LX2172IDMT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
DIP,
|
SOP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
9 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
40 V
|
35 V
|
| Input Voltage-Min |
3 V
|
3 V
|
| Input Voltage-Nom |
5 V
|
15 V
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
|
| Length |
9.525 mm
|
4.9 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
3.5 A
|
2.8 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Switcher Configuration |
BOOST
|
BOOST
|
| Switching Frequency-Max |
115 kHz
|
115 kHz
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| Moisture Sensitivity Level |
|
1
|
| Seated Height-Max |
|
1.75 mm
|
|
|
|
Compare MIC3172YN with alternatives
Compare LX2172IDMT with alternatives