MIC38C43-1YM
vs
MIC38C45BN
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICREL INC
|
| Package Description |
LSOP,
|
DIP, DIP8,.3
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
7 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
18 V
|
30 V
|
| Input Voltage-Min |
12 V
|
8.2 V
|
| Input Voltage-Nom |
15 V
|
15 V
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDIP-T8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
8.65 mm
|
9.525 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
0.5 A
|
0.5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSOP
|
DIP
|
| Package Equivalence Code |
SOP14,.25
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
|
| Surface Mount |
YES
|
NO
|
| Switcher Configuration |
BUCK
|
BOOST
|
| Switching Frequency-Max |
500 kHz
|
500 kHz
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3.9 mm
|
7.62 mm
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
8
|
|
|
|
Compare MIC38C43-1YM with alternatives
Compare MIC38C45BN with alternatives