MIC5841BN vs MIC5841BWM feature comparison

MIC5841BN Micrel Inc

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MIC5841BWM Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICREL INC ROCHESTER ELECTRONICS LLC
Part Package Code DIP SOIC
Package Description PLASTIC, DIP-18 SOIC-18
Pin Count 18 18
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Built-in Protections TRANSIENT TRANSIENT
Driver Number of Bits 8
Interface IC Type SIPO BASED PERIPHERAL DRIVER SIPO BASED PERIPHERAL DRIVER
JESD-30 Code R-PDIP-T18 R-PDSO-G18
JESD-609 Code e0 e0
Number of Functions 1 1
Number of Terminals 18 18
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Current Flow Direction SINK SINK
Output Current-Max 0.35 A
Output Peak Current Limit-Nom 0.5 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240 240
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 3.937 mm 2.65 mm
Supply Voltage-Max 12 V 12 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 7.62 mm 7.5 mm
Base Number Matches 2 3
Pbfree Code No
Length 11.55 mm
Moisture Sensitivity Level 1

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