MIC5841BVT&R
vs
MIC5841BN
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QCCJ,
|
DIP-18
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Built-in Protections |
TRANSIENT
|
TRANSIENT
|
| Interface IC Type |
SIPO BASED PERIPHERAL DRIVER
|
SIPO BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
S-PQCC-J20
|
R-PDIP-T18
|
| Length |
8.94 mm
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
18
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current Flow Direction |
SINK
|
SINK
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
DIP18,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
3.937 mm
|
| Supply Voltage-Max |
12 V
|
12 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.94 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
18
|
| Samacsys Manufacturer |
|
Microchip
|
| Driver Number of Bits |
|
8
|
| JESD-609 Code |
|
e0
|
| Output Current-Max |
|
0.35 A
|
| Output Peak Current Limit-Nom |
|
0.5 A
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MIC5841BVT&R with alternatives
Compare MIC5841BN with alternatives