MIC58P42YN
vs
MIC58P42BWM
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
DIP-18
|
SOIC-18
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Built-in Protections |
TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE
|
TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE
|
| Driver Number of Bits |
8
|
|
| Input Characteristics |
STANDARD
|
|
| Interface IC Type |
SIPO BASED PERIPHERAL DRIVER
|
SIPO BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
R-PDIP-T18
|
R-PDSO-G18
|
| JESD-609 Code |
e3
|
e0
|
| Length |
22.86 mm
|
11.55 mm
|
| Number of Functions |
8
|
8
|
| Number of Terminals |
18
|
18
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current Flow Direction |
SINK
|
SINK
|
| Output Peak Current Limit-Nom |
0.5 A
|
0.5 A
|
| Output Polarity |
INVERTED
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP18,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Seated Height-Max |
3.81 mm
|
2.65 mm
|
| Supply Current-Max |
10 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.5 mm
|
| Base Number Matches |
1
|
3
|
| Moisture Sensitivity Level |
|
1
|
| Qualification Status |
|
Not Qualified
|
| Supply Voltage-Min |
|
3 V
|
|
|
|
Compare MIC58P42YN with alternatives
Compare MIC58P42BWM with alternatives