MIC826ZYMT
vs
ADM823ZYKS-R7
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ANALOG DEVICES INC
|
Package Description |
TDFN-6
|
PLASTIC, MO-203AA, SC-70, 5 PIN
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N
|
BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N
|
Adjustable Threshold |
NO
|
NO
|
Analog IC - Other Type |
VOLTAGE SUPERVISOR/RESET IC
|
VOLTAGE SUPERVISOR/RESET IC
|
JESD-30 Code |
S-PDSO-N6
|
R-PDSO-G5
|
Length |
1.6 mm
|
2 mm
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
5
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
TSSOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Seated Height-Max |
0.6 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1 V
|
1.2 V
|
Supply Voltage-Nom (Vsup) |
1.2 V
|
2.38 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Threshold Voltage-Nom |
+2.315V
|
|
Width |
1.6 mm
|
1.25 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
TSSOT
|
Pin Count |
|
5
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
1
|
Package Equivalence Code |
|
TSSOP5/6,.08
|
Peak Reflow Temperature (Cel) |
|
240
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max (Isup) |
|
0.012 mA
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare MIC826ZYMT with alternatives
Compare ADM823ZYKS-R7 with alternatives