ML2271CCP
vs
ML2271CMJ
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICRO LINEAR CORP
|
MICRO LINEAR CORP
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP, DIP20,.3
|
DIP, DIP20,.3
|
Pin Count |
20
|
20
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Input Voltage-Max |
5 V
|
6.8 V
|
Analog Input Voltage-Min |
|
-0.3 V
|
Conversion Time-Max |
1.9 µs
|
1.6 µs
|
Converter Type |
ADC, FLASH METHOD
|
ADC, FLASH METHOD
|
JESD-30 Code |
R-PDIP-T20
|
R-GDIP-T20
|
JESD-609 Code |
e0
|
e0
|
Length |
25.97 mm
|
24.51 mm
|
Linearity Error-Max (EL) |
0.0977%
|
0.098%
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
10
|
10
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Output Bit Code |
BINARY
|
OFFSET BINARY
|
Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP20,.3
|
DIP20,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
Seated Height-Max |
4.32 mm
|
5.08 mm
|
Supply Current-Max |
32 mA
|
35 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
3A001.A.2.C
|
|
|
|
Compare ML2271CCP with alternatives
Compare ML2271CMJ with alternatives