ML9352
vs
ML9352
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
OKI ELECTRIC INDUSTRY CO LTD
|
LAPIS SEMICONDUCTOR CO LTD
|
Part Package Code |
DIE
|
DIE
|
Package Description |
DIE,
|
DIE, DIE OR CHIP
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Data Input Mode |
SERIAL/PARALLEL
|
SERIAL/PARALLEL
|
Display Mode |
DOT MATRIX
|
DOT MATRIX
|
Interface IC Type |
EL DISPLAY DRIVER
|
EL DISPLAY DRIVER
|
JESD-30 Code |
X-XUUC-N
|
R-XUUC-N
|
Multiplexed Display Capability |
NO
|
NO
|
Number of Functions |
1
|
1
|
Number of Segments |
161
|
161
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIE
|
DIE
|
Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2.7 V
|
2.7 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Supply Voltage1-Max |
30 V
|
30 V
|
Supply Voltage1-Min |
18 V
|
18 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
UPPER
|
UPPER
|
fmax-Min |
1 MHz
|
1 MHz
|
Base Number Matches |
1
|
1
|
Package Equivalence Code |
|
DIE OR CHIP
|
Supply Current-Max |
|
3 mA
|
|
|
|