MM54HC00J/883 vs HD74HC00P-E feature comparison

MM54HC00J/883 Texas Instruments

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HD74HC00P-E Renesas Electronics Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP RENESAS ELECTRONICS CORP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDIP-T14
JESD-609 Code e0 e4
Length 19.43 mm 19.2 mm
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 27 ns 23 ns
Propagation Delay (tpd) 27 ns 115 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 5.06 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 1
Pbfree Code Yes
Part Package Code DIP
Pin Count 14
Load Capacitance (CL) 50 pF
Moisture Sensitivity Level 1

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Compare HD74HC00P-E with alternatives