MM54HC00J/883 vs MM74HC00SJX feature comparison

MM54HC00J/883 Texas Instruments

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MM74HC00SJX onsemi

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ON SEMICONDUCTOR
Package Description DIP, DIP14,.3 SOP, SOP14,.3
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0 e3
Length 19.43 mm 10.2 mm
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 27 ns 23 ns
Propagation Delay (tpd) 27 ns 113 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 2.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD Matte Tin (Sn) - annealed
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.3 mm
Base Number Matches 3 1
Pbfree Code Yes
Manufacturer Package Code 565BE
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Load Capacitance (CL) 50 pF
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MM54HC00J/883 with alternatives

Compare MM74HC00SJX with alternatives