MM54HC00J/883
vs
DV74HC00AN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
AVG SEMICONDUCTORS
Package Description
DIP,
DIP, DIP14(UNSPEC)
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
Length
19.43 mm
18.86 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
27 ns
110 ns
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
4.69 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Base Number Matches
3
1
Part Package Code
DIP
Pin Count
14
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Package Equivalence Code
DIP14(UNSPEC)
Prop. Delay@Nom-Sup
110 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO