MM54HC132J/883
vs
5962-8984502CX
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TEXAS INSTRUMENTS INC
Package Description
DIP, DIP14,.3
DIP,
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
JESD-609 Code
e0
Length
19.43 mm
19.56 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
37 ns
186 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
YES
Screening Level
MIL-STD-883
MIL-STD-883
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Part Package Code
DIP
Pin Count
14
Load Capacitance (CL)
50 pF
Max I(ol)
0.0052 A
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supply Current-Max (ICC)
0.04 mA
Prop. Delay@Nom-Sup
186 ns
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MM54HC132J/883 with alternatives
Compare 5962-8984502CX with alternatives