MM54HC132J/883 vs 74HC03DB,112 feature comparison

MM54HC132J/883 Texas Instruments

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74HC03DB,112 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Package Description DIP, DIP14,.3 SOT-337-1, SSOP-14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Length 19.43 mm 6.2 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SSOP
Package Equivalence Code DIP14,.3 SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 37 ns 29 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.3 mm
Base Number Matches 1 2
Part Package Code SSOP1
Pin Count 14
Manufacturer Package Code SOT337-1
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Output Characteristics OPEN-DRAIN
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 29 ns
Time@Peak Reflow Temperature-Max (s) 30

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Compare 74HC03DB,112 with alternatives