MM54HC132J/883 vs 74HC132PW-Q100,118 feature comparison

MM54HC132J/883 Texas Instruments

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74HC132PW-Q100,118 NXP Semiconductors

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Source Content uid MM54HC132J/883 74HC132PW-Q100,118
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Package Description DIP, DIP14,.3 TSSOP, TSSOP14,.25
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0
Length 19.43 mm 5 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP14,.3 TSSOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 2/6 V 2/6 V
Propagation Delay (tpd) 37 ns 190 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Screening Level MIL-STD-883 AEC-Q100
Seated Height-Max 5.08 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 4.4 mm
Base Number Matches 1 2
Part Package Code TSSOP
Pin Count 14
Manufacturer Package Code SOT402-1
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Packing Method TAPE AND REEL
Prop. Delay@Nom-Sup 38 ns

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