MM54HC132J/883C vs CD74HC00M feature comparison

MM54HC132J/883C National Semiconductor Corporation

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CD74HC00M Harris Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP HARRIS SEMICONDUCTOR
Package Description DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-CDIP-T14 R-PDSO-G14
JESD-609 Code e0 e0
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 186 ns 27 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Screening Level MIL-STD-883 Class C
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 2 6
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Prop. Delay@Nom-Sup 27 ns

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