MM54HC132J/883C vs SN74HC132PWLE feature comparison

MM54HC132J/883C Texas Instruments

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SN74HC132PWLE Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP TEXAS INSTRUMENTS INC
Package Description DIP, DIP14,.3 TSSOP, TSSOP14,.25
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-CDIP-T14 R-PDSO-G14
JESD-609 Code e0
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP14,.3 TSSOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 186 ns 156 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Screening Level MIL-STD-883 Class C
Seated Height-Max 5.08 mm 1.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 4.4 mm
Base Number Matches 2 1
Pbfree Code No
Part Package Code TSSOP
Pin Count 14
Length 5 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 31 ns
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MM54HC132J/883C with alternatives

Compare SN74HC132PWLE with alternatives