MM54HC157J/883 vs 74HC157N,652 feature comparison

MM54HC157J/883 Rochester Electronics LLC

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74HC157N,652 NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Package Description DIP, 0.300 INCH, PLASTIC, SOT38-4, DIP-16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T16 R-PDIP-T16
Length 19.43 mm 21.6 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 37 ns 38 ns
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 4.7 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 3 1
Rohs Code Yes
Part Package Code DIP
Pin Count 16
Manufacturer Package Code SOT38-4
Factory Lead Time 4 Weeks
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP16,.3
Packing Method BULK
Prop. Delay@Nom-Sup 38 ns
Qualification Status Not Qualified
Terminal Finish NICKEL PALLADIUM GOLD

Compare MM54HC157J/883 with alternatives

Compare 74HC157N,652 with alternatives