MM54HC4060J
vs
MC74HC4060ADTR2
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
ON SEMICONDUCTOR
|
| Package Description |
DIP, DIP16,.3
|
TSSOP, TSSOP16,.25
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
OUTPUTS FROM 10 STAGES AVAILABLE; BUILT-IN OSCILLATOR; OSCILLATOR DISABLED BY CLEAR INPUT
|
OUTPUTS FROM 10 STAGES AVAILABLE
|
| Count Direction |
UP
|
UP
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e4
|
| Length |
19.43 mm
|
5 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Load/Preset Input |
NO
|
NO
|
| Logic IC Type |
BINARY COUNTER
|
BINARY COUNTER
|
| Max Frequency@Nom-Sup |
4000000 Hz
|
25000000 Hz
|
| Max I(ol) |
0.0052 A
|
0.004 A
|
| Mode of Operation |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Number of Bits |
14
|
14
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Equivalence Code |
DIP16,.3
|
TSSOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Propagation Delay (tpd) |
171 ns
|
1000 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
NEGATIVE EDGE
|
NEGATIVE EDGE
|
| Width |
7.62 mm
|
4.4 mm
|
| fmax-Min |
24 MHz
|
40 MHz
|
| Base Number Matches |
4
|
2
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
16
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
|
|
|
Compare MM54HC4060J with alternatives
Compare MC74HC4060ADTR2 with alternatives