MM74C73J
vs
5962R9660501VXX
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
HARRIS SEMICONDUCTOR
|
| Package Description |
DIP, DIP14,.3
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
MASTER SLAVE OPERATION
|
RADIATION HARDENED; INPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT
|
| Family |
CMOS
|
4000/14000/40000
|
| JESD-30 Code |
R-GDIP-T14
|
R-CDFP-F16
|
| JESD-609 Code |
e0
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
J-K FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
2500000 Hz
|
|
| Max I(ol) |
0.00035999999999999997 A
|
|
| Number of Bits |
2
|
6
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
14
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
COMPLEMENTARY
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DFP
|
| Package Equivalence Code |
DIP14,.3
|
FL16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Propagation Delay (tpd) |
300 ns
|
405 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max (Vsup) |
15 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
NEGATIVE EDGE
|
POSITIVE EDGE
|
| Width |
7.62 mm
|
|
| fmax-Min |
2.5 MHz
|
2.59 MHz
|
| Base Number Matches |
2
|
3
|
| Total Dose |
|
100k Rad(Si) V
|
|
|
|
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