Findchips: Compare MM74C86CW vs 74HC32BQ,115

MM74C86CW vs 74HC32BQ,115 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	FAIRCHILD SEMICONDUCTOR CORP	NXP SEMICONDUCTORS
Part Package Code	WAFER	QFN
Package Description	DIE,	2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	CMOS	HC/UH
JESD-30 Code	X-XUUC-N14	R-PQCC-N14
Logic IC Type	XOR GATE	OR GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Package Body Material	UNSPECIFIED	PLASTIC/EPOXY
Package Code	DIE	HVQCCN
Package Shape	UNSPECIFIED	RECTANGULAR
Package Style	UNCASED CHIP	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Propagation Delay (tpd)	185 ns	135 ns
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	15 V	6 V
Supply Voltage-Min (Vsup)	3 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Form	NO LEAD	NO LEAD
Terminal Position	UPPER	QUAD
Base Number Matches	1	2
Rohs Code		Yes
Pin Count		14
Manufacturer Package Code		SOT762-1
JESD-609 Code		e4
Length		3 mm
Load Capacitance (CL)		50 pF
Max I(ol)		0.004 A
Moisture Sensitivity Level		1
Operating Temperature-Max		125 °C
Operating Temperature-Min		-40 °C
Package Equivalence Code		LCC14,.1X.12,20
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		27 ns
Schmitt Trigger		NO
Seated Height-Max		1 mm
Temperature Grade		AUTOMOTIVE
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch		0.5 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		2.5 mm
	Logic » Gates	Logic » Gates