MM74HC00J vs 74HC132DB-T feature comparison

MM74HC00J Rochester Electronics LLC

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74HC132DB-T NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code DIP SSOP
Package Description DIP, SSOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Length 19.43 mm 6.2 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 23 ns 38 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.3 mm
Base Number Matches 4 1
Load Capacitance (CL) 50 pF
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare 74HC132DB-T with alternatives