MM74HC00J vs GD74HCT00J feature comparison

MM74HC00J Rochester Electronics LLC

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GD74HCT00J Goldstar Electron Co Ltd

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC GOLDSTAR ELECTRON CO LTD
Part Package Code DIP
Package Description DIP, ,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HC/UH HCT
JESD-30 Code R-GDIP-T14 R-CDIP-T14
JESD-609 Code e0
Length 19.43 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 23 ns 24 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 4 2
Load Capacitance (CL) 50 pF

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