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MM74HC00M ON SemiconductorBuy Now Datasheet |
74HC00D-Q100,118 NexperiaBuy Now Datasheet |
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | Yes |
| Part Life Cycle Code | Active | Active |
| Ihs Manufacturer | ON SEMICONDUCTOR | NEXPERIA |
| Package Description | SOP, SOP14,.25 | SOP, |
| Manufacturer Package Code | 751EF | SOT108-1 |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Family | HC/UH | HC/UH |
| JESD-30 Code | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609 Code | e4 | e4 |
| Length | 8.6235 mm | 8.65 mm |
| Load Capacitance (CL) | 50 pF | |
| Logic IC Type | NAND GATE | NAND GATE |
| Max I(ol) | 0.004 A | |
| Moisture Sensitivity Level | 1 | 1 |
| Number of Functions | 4 | 4 |
| Number of Inputs | 2 | 2 |
| Number of Terminals | 14 | 14 |
| Operating Temperature-Max | 85 °C | 125 °C |
| Operating Temperature-Min | -40 °C | -40 °C |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Code | SOP | SOP |
| Package Equivalence Code | SOP14,.25 | |
| Package Shape | RECTANGULAR | RECTANGULAR |
| Package Style | SMALL OUTLINE | SMALL OUTLINE |
| Packing Method | RAIL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Power Supplies | 2/6 V | |
| Prop. Delay@Nom-Sup | 23 ns | |
| Propagation Delay (tpd) | 113 ns | 135 ns |
| Qualification Status | Not Qualified | |
| Schmitt Trigger | NO | |
| Seated Height-Max | 1.753 mm | 1.75 mm |
| Supply Voltage-Max (Vsup) | 6 V | 6 V |
| Supply Voltage-Min (Vsup) | 2 V | 2 V |
| Supply Voltage-Nom (Vsup) | 4.5 V | 5 V |
| Surface Mount | YES | YES |
| Technology | CMOS | CMOS |
| Temperature Grade | INDUSTRIAL | AUTOMOTIVE |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING | GULL WING |
| Terminal Pitch | 1.27 mm | 1.27 mm |
| Terminal Position | DUAL | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 3.9 mm | 3.9 mm |
| Base Number Matches | 4 | 2 |
| Part Package Code | SOIC | |
| Pin Count | 14 | |
| Screening Level | AEC-Q100 | |
