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MM74HC00M vs 74HC00DB feature comparison

MM74HC00M Rochester Electronics LLC

Buy Now Datasheet

74HC00DB NXP Semiconductors

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Contact Manufacturer Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code SOIC SSOP
Package Description SOP, 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e3 e4
Length 8.6235 mm 6.2 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 113 ns 135 ns
Seated Height-Max 1.753 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish MATTE TIN NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3.9 mm 5.3 mm
Base Number Matches 4 3
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code SSOP14,.3
Packing Method TUBE
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 27 ns
Qualification Status Not Qualified
Schmitt Trigger NO

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