MM74HC00MX vs CD74HC132E feature comparison

MM74HC00MX National Semiconductor Corporation

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CD74HC132E General Electric Solid State

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP GENERAL ELECTRIC SOLID STATE
Package Description PLASTIC, SO-14 DIP-14
Reach Compliance Code unknown unknown
Family HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 23 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm
Base Number Matches 5 6
Rohs Code No
HTS Code 8542.39.00.01
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 31 ns
Schmitt Trigger YES