MM74HC00MX vs MM74HCT00N feature comparison

MM74HC00MX Fairchild Semiconductor Corporation

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MM74HCT00N Rochester Electronics LLC

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP ROCHESTER ELECTRONICS INC
Part Package Code SOIC DIP
Package Description 0.150 INCH, MS-012, SOIC-14 DIP,
Pin Count 14 14
Manufacturer Package Code 14LD,SOIC,JEDEC MS-012, .150", NARROW BODY
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Family HC/UH HCT
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e3 e3
Length 8.6235 mm 19.18 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1 NOT APPLICABLE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260 NOT APPLICABLE
Prop. Delay@Nom-Sup 23 ns
Propagation Delay (tpd) 113 ns 29 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.753 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT APPLICABLE
Width 3.9 mm 7.62 mm
Base Number Matches 5 5

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