MM74HC00N
vs
TC74HC00APF
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Contact Manufacturer
|
Active
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
TOSHIBA CORP
|
Part Package Code |
DIP
|
DIP
|
Package Description |
0.300 INCH, PLASTIC, MS-001, DIP-14
|
DIP, DIP14,.3
|
Pin Count |
14
|
14
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-PDIP-T14
|
R-PDIP-T14
|
JESD-609 Code |
e3
|
|
Length |
19.18 mm
|
19.25 mm
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Propagation Delay (tpd) |
113 ns
|
95 ns
|
Seated Height-Max |
5.08 mm
|
4.45 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
4.5 V
|
4.5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
5
|
1
|
Factory Lead Time |
|
53 Weeks, 1 Day
|
Samacsys Manufacturer |
|
Toshiba
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.004 A
|
Package Equivalence Code |
|
DIP14,.3
|
Packing Method |
|
TUBE
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Prop. Delay@Nom-Sup |
|
19 ns
|
Qualification Status |
|
Not Qualified
|
Schmitt Trigger |
|
NO
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MM74HC00N with alternatives
Compare TC74HC00APF with alternatives