MM74HC00NX vs JM38510/65001BCA feature comparison

MM74HC00NX onsemi

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JM38510/65001BCA National Semiconductor Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ON SEMICONDUCTOR NATIONAL SEMICONDUCTOR CORP
Package Description DIP, CERAMIC, DIP-14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-GDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 113 ns 135 ns
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 3
JESD-609 Code e0
Length 19.45 mm
Package Equivalence Code DIP14,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Screening Level MIL-M-38510 Class B
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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