Findchips: Compare MM74HC00SJ vs 74HC132DB,118

MM74HC00SJ vs 74HC132DB,118 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	Yes
Rohs Code	Yes	Yes
Part Life Cycle Code	Contact Manufacturer	Transferred
Ihs Manufacturer	ROCHESTER ELECTRONICS LLC	NXP SEMICONDUCTORS
Part Package Code	SOIC	SSOP1
Package Description	5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14	SOT-337-1, SSOP-14
Pin Count	14	14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-PDSO-G14	R-PDSO-G14
JESD-609 Code	e3	e4
Length	10.2 mm	6.2 mm
Logic IC Type	NAND GATE	NAND GATE
Moisture Sensitivity Level	1	1
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	85 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	SSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd)	113 ns	38 ns
Seated Height-Max	2.1 mm	2 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	4.5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	AUTOMOTIVE
Terminal Finish	MATTE TIN	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	1.27 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	5.3 mm	5.3 mm
Base Number Matches	3	2
Manufacturer Package Code		SOT337-1
Load Capacitance (CL)		50 pF
Max I(ol)		0.004 A
Package Equivalence Code		SSOP14,.3
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		38 ns
Qualification Status		Not Qualified
Schmitt Trigger		YES
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates