MM74HC00SJ vs TC74HC00AF(TP1) feature comparison

MM74HC00SJ Rochester Electronics LLC

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TC74HC00AF(TP1) Toshiba America Electronic Components

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Contact Manufacturer Active
Ihs Manufacturer ROCHESTER ELECTRONICS LLC TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e3 e0
Length 10.2 mm 10.3 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 113 ns 19 ns
Seated Height-Max 2.1 mm 1.9 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm 5.3 mm
Base Number Matches 3 1
Source Content uid TC74HC00AF(TP1)
Load Capacitance (CL) 50 pF
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare TC74HC00AF(TP1) with alternatives