MM74HC00SJX vs TC74HC00AF(TP1) feature comparison

MM74HC00SJX onsemi

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TC74HC00AF(TP1) Toshiba America Electronic Components

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Source Content uid MM74HC00SJX TC74HC00AF(TP1)
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ON SEMICONDUCTOR TOSHIBA CORP
Package Description SOP, SOP14,.3 SOP,
Manufacturer Package Code 565BE
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e3 e0
Length 10.2 mm 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 23 ns
Propagation Delay (tpd) 113 ns 19 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 2.1 mm 1.9 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) - annealed TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 5.3 mm 5.3 mm
Base Number Matches 3 1
Part Package Code SOIC
Pin Count 14

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