MM74HC02M vs 74HC02D feature comparison

MM74HC02M National Semiconductor Corporation

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74HC02D NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Package Description PLASTIC, SO-14 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Reach Compliance Code compliant unknown
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e4
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 23 ns 27 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 5 4
Pbfree Code Yes
Part Package Code SOIC
Pin Count 14
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer NXP
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 27 ns
Time@Peak Reflow Temperature-Max (s) 30

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