MM74HC02N vs TC74HC02APF feature comparison

MM74HC02N Fairchild Semiconductor Corporation

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TC74HC02APF Toshiba America Electronic Components

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP TOSHIBA CORP
Part Package Code DIP DIP
Package Description 0.300 INCH, PLASTIC, MS-001, DIP-14 DIP, DIP14,.3
Pin Count 14 14
Manufacturer Package Code 14LD, MDIP,JEDEC MS-001, .300" WIDE
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e3
Length 19.18 mm 19.25 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 27 ns 19 ns
Propagation Delay (tpd) 113 ns 95 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 5.08 mm 4.45 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Factory Lead Time 24 Weeks
Samacsys Manufacturer Toshiba

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