MM74HC132J
vs
5962-8984501CA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TEXAS INSTRUMENTS INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP14,.3
CERAMIC, DIP-14
Pin Count
14
14
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HCT
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
JESD-609 Code
e0
e0
Length
19.43 mm
19.56 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
1
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
32 ns
50 ns
Qualification Status
Not Qualified
Qualified
Schmitt Trigger
YES
YES
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
4
ECCN Code
EAR99
Max I(ol)
0.004 A
Packing Method
TUBE
Power Supply Current-Max (ICC)
0.04 mA
Prop. Delay@Nom-Sup
50 ns
Screening Level
MIL-STD-883
Compare MM74HC132J with alternatives
Compare 5962-8984501CA with alternatives