MM74HC132J vs 74HC03DB feature comparison

MM74HC132J National Semiconductor Corporation

Buy Now Datasheet

74HC03DB NXP Semiconductors

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Package Description DIP, DIP14,.3 SOT-337-1, SSOP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 4850.05 149.35
CO2e (mg) 60140.616 1851.94
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Length 19.43 mm 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SSOP
Package Equivalence Code DIP14,.3 SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 32 ns 29 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 5.08 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.3 mm
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code SSOP
Pin Count 14
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Output Characteristics OPEN-DRAIN
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 29 ns
Time@Peak Reflow Temperature-Max (s) 30

Compare MM74HC132J with alternatives

Compare 74HC03DB with alternatives