MM74HC132J vs 74HCT132D,652 feature comparison

MM74HC132J National Semiconductor Corporation

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74HCT132D,652 NXP Semiconductors

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Source Content uid MM74HC132J 74HCT132D,652
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Package Description DIP, DIP14,.3 SOP, SOP14,.25
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HCT
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Length 19.43 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Power Supplies 2/6 V 5 V
Propagation Delay (tpd) 32 ns 50 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 2 2
Part Package Code SOIC
Pin Count 14
Manufacturer Package Code SOT108-1
Factory Lead Time 4 Weeks
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Packing Method BULK PACK
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 41 ns
Time@Peak Reflow Temperature-Max (s) 30

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