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MM74HC132J vs HD74HC00RPEL feature comparison

MM74HC132J Texas Instruments

Buy Now Datasheet

HD74HC00RPEL Renesas Electronics Corporation

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP RENESAS ELECTRONICS CORP
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 3.95 X 8.65 MM, 1.27 MM PITCH, PLASTIC, SOP-14
Pin Count 14 14
HTS Code 8542.39.00.01 8542.31.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0
Length 19.43 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Power Supplies 2/6 V 2/6 V
Propagation Delay (tpd) 32 ns 115 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 7.62 mm 3.95 mm
Base Number Matches 2 1
ECCN Code EAR99
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Packing Method TAPE AND REEL
Prop. Delay@Nom-Sup 23 ns

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